Kouman mwen ka konfime konpatibilite nan dite silicone ak pwosesis la enprime?
Epè - Plak enprime (twa - dimansyon leve soti vivan sifas):
Si wotè sifas ki leve a pi gran pase 1mm, ba - silikone dite (<30°A) will easily collapse under its own weight, so a 35–45°A should be selected. If the raised surface height is less than 0.5mm, a 25–35°A should be selected to ensure a delicate feel.
Milti - kouch overprinting (milti - koulè kouvri):
Silicone nan kouch baz yo ta dwe yon ti kras pi rèd pase kouch nan tèt (egzanp, 40 degre A pou kouch nan baz, 35 degre A pou kouch nan tèt) pou fè pou evite silikone nan tèt tèt ke yo te twò mou, ki ka lakòz modèl twoub pandan surprint.
Ba - aplikasyon pou geri tanperati (egzanp, chalè - twal sansib):
Kèk ba - silikon dite (<25°A) require high-temperature curing (above 120°C). If the substrate is not heat-resistant (e.g., wool or acetate), switch to a "low-temperature curing medium-hardness silicone" (35–45°A, curing temperature 80–100°C) to avoid damage to the fabric.